Dry release of all-polymer structures
We present a simple dry release technique which uses a thin fluorocarbon film for efficient removal of plastic microdevices from a mould or a handling substrate by reducing the adhesion between the two. This fluorocarbon film is deposited on the substrate in an advanced Si dry etch device utilising the C4F8 passivation plasma. Micromachined polymer chips made of SU-8 are removed from the handling