Operando study of HfO2 atomic layer deposition on partially hydroxylated Si(111)
The introduction of atomic layer deposition (ALD), to the microelectronics industry has introduced a large number of new possible materials able to be deposited in layers with atomic thickness control. One such material is the high-κ oxide HfO2; thermally stable and ultrathin HfO2 films deposited by ALD are a significant contender to replace SiO2 as the gate oxide in capacitor applications. We pre