Pass number dependence of through-thickness microstructure homogeneity in tantalum sheets under the change of strain path
Microstructure and crystallographic texture are the key factors that determine the properties of sputtering target used in integrated circuit fabrication. Multi-pass clock-rolling has been used recently to produce Ta sputtering targets. However, the effect of strain per pass, or the number of passes to achieve desired thickness, in clock-rolling on the homogeneity of final microstructure has not b