A Fully Integrated 26dBm Linearized RF Power Amplifier in 65nm CMOS Technology
In this paper, design and measurements of a fully integrated power amplifier (PA) are presented. The PA consists of two amplifying chains each having a driver and a power stage. A low loss on chip power combiner combines the outputs from two amplifying chains, and also performs impedance transformation and differential to single-ended conversion. To linearize the PA, the driver stage is biased in