Stress analysis around a through crack shaped void in a single crystal copper strip coated on an infinitely stiff material using molecular dynamics
A small rectangular strip of fcc Cu, containing a through crack on the nanoscale and subjected to loading under displacement control, is simulated using molecular dynamics (MD). The geometry is highly constrained and chosen to mimic that of a thin film between two stiff layers. The Lennard Jones pair potential is used for the inter-atomic forces. The centrally placed crack-shaped void is created b