Stress analysis of highly constrained copper strips with through crack shaped voids using molecular dynamics
A small rectangular strip of fcc Cu, containing a through crack on the nanoscale and subjected to loading under displacement control, is simulated using molecular dynamics (MD). The geometry is highly constrained and chosen to mimic that of a thin strip between two stiff layers. The Lennard-Jones pair potential is used for the inter-atomic forces. The centrally placed crack shaped void is created
