Computational optimization of counter-flow double-layered microchannel heat sinks subjected to thermal resistance and pumping power
Various microchannel heat sinks are widely used to cool electronic chips, but they are often designed to be single-layer channels. To a certain extent, single-layered microchannel heat sinks can solve the problem of high heat flux. However, due to the limitation of pumping power, only a small coolant flow rate can be adopted; and the temperature of the heated plate is non-uniform. In this paper, t
