Laminar thermal performance of microchannel heat sinks with constructal vertical Y-shaped bifurcation plates
With increasing output power of integrated chips, the involved heat flux is accordingly increased. Traditional cooling methods failed to satisfy such a situation, and thus new cooling methods incorporating microchannel heat sinks with high capabilities of heat removal are necessary. In this paper, on the basis of a water-cooled smooth microchannel heat sink, vertical Y-shaped bifurcation plates ar