Optimizing FinFET Geometry using a Chemical Mechanical Polishing Process
This paper aims to test the viability of using chemical mechanical polishing (CMP) in the manufacturing of vertical FinFET structures, and optimize the process parameters to this end. While the overarching goal is to facilitate production of gallium nitride FinFET structures for high-power applications through repeated employment of deposition and planarization with CMP, the process is initially v
