High-Density Standard Cell Library for Sequential 3D Integrated Circuits
Research efforts to push the integration density of circuits with technologies that transcend Moore's law have gained significant attention in recent years. This study investigates the silicon area gains of Sequential 3D technology, utilizing the third dimension of integrated circuits by accommodating nMOS and pMOS transistors in two stacked tiers with high-density and low-pitch 3D vias. The effic
